Fakultät für Technische Wissenschaften
In this talk, the back-end processing and integration technologies of MEMS devices will be addressed. Unlike electronics IC packaging, MEMS packaging in not well-established, is expensive (up to 80% of the product total cost and is custom-built. Here, we will introduce the basics of MEMS packaging in different levels of integrations. The common backend processes will be covered in this talk such as wafer dicing, wafer thinning, wafer bonding, molding and over-molding, die-attach, solder bumping and wire bonding, etc. We will also briefly introduce the state of the art and future trends of MEMS packaging and some terminologies such as 3D integration with and without TSVs, FOLWP, C2C, C2W, W2W, SiP, SiB, for MEMS integration will be described.
Dr. Ali Roshanghias
Kerstin Smounig (Kerstin.Smounig [at] aau.at)